3880 Die Bonder Overview
The new 3880 features a fully integrated Z-Theta bidirectional bond head enabling reduced maintenance and uniformity across a wide range of applications. The new machine’s combined fine placement accuracy, fast indexing time, excellent tool planarity and repeatability make it the most advanced die bonder platform available today. Presentation options include wafer, waffle/gel pak, tape and reel, boats, and carriers. Custom stages are also available.
CYCLE TIME
Up to 2600 UPH, axis speeds near 40 ips with resolution of 0.1μ over work area. Linear encoders are used for absolute positioning
PLACEMENT REPEATABILITY
3.5μ, 3σ
PLACEMENT ACCURACY
5μ (0.000196 inch), 3σ
True radial position depending on application
LARGE WORK AREA
914.4 x 508.0 mm (36 x 20 inch) work envelope for a versatile automated die bonder capable of handling many different part types, presentation options, and application processes
Applications
? AOC- Active Optical Cable
? Chip-on-board
? HB/HP LED assembly
? Microwave modules
? RF packages
? Hybrid microcircuits
? VCSEL, PD, DFB Laser, and Lens Attach
? Solid State Lasers
? MEMS
? LED printhead attachment
? RF Power Amplifier
? Solar concentrator packaging
? MOEMS
COMPONENT PLACEMENT APPLICATIONS
? AuSi eutectic scrub
? AuSn eutectic solder attach
? PbSn solder preform
? Anisotropic conductive paste or film for flip chip attachment
? High accuracy placement of optical components
? Conductive epoxy VCSEL and PD
? In-situ UV snap curing die or lens attach
The 3880 Die Bonder data sheet:
Download the 3880 Die Bonder data sheet
