+ 100u to 500u Aluminium Wire
+ 6,5" TFT Touch Screen
+ 100 Program Storage Capacities
+ Built in Dual Fiber Optic illuminator
+ Motorised Z Bond Head
+ Motorized Y travel for Step-Back loop control
+ 6:1 ratio X-Y manipulator
+ Loop Profile Programmable
+ Stitch bonding
+ Semi-auto, Step and Manual Bonding Mode
HB30 Heavy Wire Bonder
The HB30 is a bench top size wire bonder, ideal for laboratories, pilot and pre-production runs and small scale production tines. Easy operation with TFT Touch Screen Operator System. Direct access and simple adjustment to all bond parameters and programs.
Technical Specifications
Ultrasonic system
Utrasonic power
Bond time
Bond force
Aluminium wire diameter
Wire termination
Wire feed angle
Motorized Y travel
Motorized Z travel
Fine Table motion
Mouse ratio
Electrical Requirements
Physical Dimensions
Weight
Industry Standards |
PLL US System
50 Watt Output
0-10 sec.
50 - 1500cN
100u to 500u
Front Cut
90°
Stepback up to 17 mm
20 mm
15 mm
6:1 ( Option 3:1 )
100 - 240V +/-10% 50/60 Hz 10A max.
680 mm ( 27”)W x 640 mm (25") D x 490 mm ( 19”) H
Net 50 kg
CE Standards |
